I saw that, and I'm curious if that's a death-knell for LPCAMM ram. My understanding was that the entire point of that new standard was to allow for the higher ram speeds and lower latencies etc that you would normally get with soldered ram, but in a modular, swappable package.
If LPCAMM already can't keep up with requirements when it is barely even out, then my guess is it won't fare well going forward.
So 1 of 2 things is probably true:
AMD is not being completely truthful with their statements that LPCAMM wasn't able to work (maybe it was just more difficult/complicated than they were willing to do, but it could work or
latency/speed requirements have already outpaced what LPCAMM can provide and soldered ram is the future.
I really hope it's the former, but it wouldn't be the first time something like the second has occurred. Apparently cache also used to be a separate, swappable component before it became integrated into the die. RAM might end up going the same way.
If LPCAMM already can't keep up with requirements when it is barely even out, then my guess is it won't fare well going forward.
So 1 of 2 things is probably true:
AMD is not being completely truthful with their statements that LPCAMM wasn't able to work (maybe it was just more difficult/complicated than they were willing to do, but it could work or
latency/speed requirements have already outpaced what LPCAMM can provide and soldered ram is the future.
I really hope it's the former, but it wouldn't be the first time something like the second has occurred. Apparently cache also used to be a separate, swappable component before it became integrated into the die. RAM might end up going the same way.